会议通知 | ​第十八届IEEE国际固态和集成电路技术会议（ICSICT 2026）征文通知

第十八届IEEE

国际固态和集成电路技术会议

2026 IEEE 18^thInternational Conference on Solid-State and Integrated Circuit Technology (ICSICT)

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2026年10月27日-30日

中国 · 杭州

会议简介

由 IEEE 中国联合会、IEEE 北京分会、四川省电子学会及武汉理工大学联合主办，电子科技大学长三角研究院（湖州）承办的 2026 IEEE 第十八届国际固态和集成电路技术会议（2026 IEEE 18th International Conference on Solid-state and Integrated Circuit Technology, ICSICT 2026），定于2026年10 月27日至30日在杭州举办。作为中国每两年一届的顶尖学术盛会，ICSICT是固态器件与集成电路领域规模最大、影响力最深远的国际会议之一。

本届会议聚焦固态数字集成电路与系统设计、模拟电路、器件研发、工艺技术等核心方向，为期四天的议程将通过口头报告、海报展示、专题研讨及特色活动等多元形式，全面呈现全球该领域的前沿突破与创新成果。会议以“推进集成电路技术进步、促进产学研深度融合”为宗旨，届时将有来自世界各国和地区学术界、产业界的 500 余位杰出代表齐聚杭州，共话技术发展趋势，探索产业应用前景。

ICSICT

Co-sponsored by

ICSICT

Technically Co-sponsored by

ICSICT

Hosted by

ICSICT

Supported by

ICSICT

Media Partner

会议组委会

↓ 上下滑动查看完整组委会名单 ↓

Life Honorary Chair

• Yangyuan Wang,Peking University, China

Advisory Committee Co-Chairs

• Ting-Ao Tang, Fudan University, China

• Cor Claeys, Proximus, Belgium

• Mengqi Zhou, IEEE China Council, China

General Chairs

• Jan Van der Spiegel, University of Pennsylvania, USA

• Bin Zhao, IEEE EDS, USA

• Francois Rivet, University of Bordeaux, France

• Amara Amara, International Innovation Institute, Beihang University, Hangzhou Campus, China

General Co-Chairs

• Ning Xu, Wuhan University of Technology, China

• Cheng Zhuo, Zhejiang University, China

• Yuehang Xu, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

• Gaofeng Wang, Hangzhou Dianzi University, China

Technical Program Committee Chairs

• Haruo Kobayashi, Gunma University, Japan

• Ming Li, Peking University, China

• Bo Zhang, University of Electronic Science and Technology of China, China

• Yi Zhao, Huada Semiconductor, China

Technical Program Committee Co-Chairs

• Bei Yu, The Chinese University of Hong Kong, China

• Zheng Wang, University of Electronic Science and Technology of China, China

• Fakhrul Zaman Rokhani,Universiti Putra Malaysia, Malaysia

• Ling Zhang, Zhejiang University, China

• Yuchao Yang, Peking University, China

• Jing Jin, Shanghai Jiao Tong University, China

• Wentong Zhang, University of Electronic Science and Technology of China, China

• Haifeng Ling, Nanjing University of Posts and Telecommunications, China

Local Arrangement Chair

• Letian Huang, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Subcommittee Chairs

• Haifeng Ling, Nanjing University of Posts and Telecommunications, China

• Wentong Zhang, University of Electronic Science and Technology of China, China

• Jing Jin, Shanghai Jiao Tong University, China

• Yuchao Yang,Peking University, China

Subcommittee Co-Chairs

• Hailong Jiao, Peking University, China

• Zheng Wang, University of Electronic Science and Technology of China, China

• Jin Wei, Peking University, China

• Zhihao Yu, Nanjing University of Posts and Telecommunications, China

Special Session Chair

• Haimeng Huang, University of Electronic Science and Technology of China, China

Tutorial Chair

• Wei Mao, Xidian University, China

Industry Liaison Chairs

• Sylvain Eimer, Truth Equipment, China

• Preet Yadav, NXP Semiconductors, India

Publicity Co-Chairs

• Caoyu Li,Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

• Chaoyue Zheng, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Publication Committee Chair

• Mengqi Zhou, IEEE China Council, China

Publication Committee Co-chairs

• Lobna A. Said, Nile University, Egypt

• Guoqing Deng, Sichuan Institute of Electronics, China

Treasurer

• Jianhong Zhou, Xihua University, China

Secretary General

• Tiantian Han, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

征稿主题

Theme 1: Digital & System Level IC

• Chair: Yuchao Yang, Peking University, China

• Co-Chair: Hailong Jiao, Peking University, China

Track 1: Digital Architectures & Systems

Chair:

• Zhiyi Yu, Sun Yat-sen University, China

Co-Chairs:

• Yaoyu Tao, Peking University, China

• Hongyang Jia, Tsinghua University, China

Track 2: Digital Circuits

Chair:

• Yongpan Liu, Tsinghua University, China

Co-Chairs:

• Yanan Sun, Shanghai Jiao Tong University, China

• Fengbin Tu, Hong Kong University of Science and Technology, China

Track 3: Design Methodology & EDA

Chair:

• Jun Yang, Southeast University, China

Co-Chairs:

• Yibo Lin, Peking University, China

• Yu Li, Zhejiang University, China

Theme 2: Analog

• Chair: Jing Jin, Shanghai Jiao Tong University, China

• Co-Chair: Zheng Wang, University of Electronic Science and Technology of China, China

Track 4: RF & Wireless

Chair:

• Keping Wang, Tianjin University, China

Co-Chairs:

• Jian Pang, Shanghai Jiao Tong University, China

• Kai Tang,Hunan University, China

Track 5: Wireline

Chair:

• Xiaoyan Gui, Xi'an Jiaotong University, China

Co-Chairs:

• Bingyi Ye, East China Normal University, China

• Yuekang Guo, Shanghai Jiao Tong University, China

Track 6: General Analog

Chair:

• Lin Cheng, University of Science and Technology of China, China

Co-Chairs:

• Junmin Jiang, Southern University of Science and Technology, China

• Ang Hu, Huazhong University of Science and Technology, China

Theme 3: Devices

• Chair: Wentong Zhang, University of Electronic Science and Technology of China, China

• Co-Chair:Jin Wei, Peking University, China

Track 7: CMOS Logic Devices & Sensors

Chair:

• Heng Wu, Peking University, China

Co-Chairs:

• Wang Kang, Beihang University, China

• Xiaosheng Zhang, University of Electronic Science and Technology of China, China

Track 8: Power Devices & Power IC

Chair:

• Long Zhang, Southeast University, China

Co-Chairs:

• Jiafei Yao, Nanjing University of Posts and Telecommunications, China

• Zekun Zhou, University of Electronic Science and Technology of China, China

Track 9: Device Reliability & Security

Chair:

• Mengyuan Hua, Southern University of Science and Technology, China

Co-Chairs:

• Sen Huang, Institute of Microelectronics of Chinese Academy of Sciences, China

• Zhao Qi, University of Electronic Science and Technology of China, China

Theme 4: Process & Technologies

• Chair: Haifeng Ling, Nanjing University of Posts and Telecommunications, China

• Co-Chair: Zhihao Yu, Nanjing University of Posts and Telecommunications, China

Track 10: Semiconductor Process Technologies

Chair:

• Bobo Tian, East China Normal University, China

Co-Chairs:

• Min Liao, Xidian University, China

• Li Zhu, Nanjing University of Posts and Telecommunications, China

Track 11: Optoelectronics and Silicon Photonics Integration

Chair:

• Linfeng Sun, Beijing Institute of Technology, China

Co-Chairs:

• Ming Xu, Huazhong University of Science and Technology, China

• Yuanfang Yu, Nanjing University of Posts and Telecommunications, China

Track 12: Packaging Technologies

Chair:

• Jun Zhang,Nanjing University of Posts and Telecommunications, China

Co-Chairs:

• Shenyang Mo,NARI Semiconductor R&D Center, China

• Pengfei Zhao, Nanjing University of Posts and Telecommunications, China

投稿方式

投稿作者需按照论文模板撰写论文，提交至少3页的英文文章，被录用文章将收录于会议论文集。

或前往easychair投稿

https://easychair.org/conferences/?conf=icsict2026

投稿要求

论文模板

重要时间

征稿截止日期：2026年6月25日

录用通知日期：2026年7月25日

组织特别分会

ICSICT 2026组委会邀请专家学者积极组织特别分会，展示自己的先进研究成果！

有意组织的学者请在2026年2月1日前将提案发送至会议邮箱。（ieeeicsict@outlook.com）。

提案模板

通过下方链接下载：

https://www.icsict.org/ICSICT_2026_Special_Session_Proposal_Template.docx

相聚杭州

杭州市，坐落于风景如画江浙腹地，是一座以永恒之美和丰富文化遗产闻名的城市。

杭州最著名的景点之一是西湖，它被联合国教科文组织列为世界遗产。除此之外，京杭大运河、灵隐寺、钱塘江以及新兴升起的电子商务产业，都让这座富有历史底蕴的城市散发新的光芒。

ICSICT 2026组委会诚挚邀请您参与会议，于金秋10月相约在这座美丽的城市！

联系方式

会议秘书：钟女士

联系电话：+86-186 282 638 76

会议邮箱：

icsict2026@csj.uestc.edu.cn

ieeeicsict@outlook.com

会议官网：www.icsict.org